Highly Integrated Ethernet to PDH Mapper for Wireless and Wireline Applications (TXC-07861)


The demand for Ethernet services has forced Service Providers to reconsider their deployment strategies of next-generation wireline and wireless platforms. As a result, how can Service Providers offer Ethernet services with minimal impact on capital and operational expenditure.

The EtherMap®-PDH device provides a solution that is cost-effective by re-using both the existing copper infrastructure and the typical SONET/SDH platform at the central office. An EtherMap®-PDH enabled line card on a CPE maps Ethernet frames via GFP/HDLC/LAPS into bonded PDH signals. The ability to extend the Ethernet service to the last-mile will provide a complementary solution to Ethernet-over-SONET/SDH (EoS).

The EtherMap®-PDH device has three unique modes of operation that are applicable to a variety of wireline and wireless applications: E1/T1/J1 – Ethernet frames mapped into 16 x E1/T1/J1, DS3 – Ethernet frames mapped into 3 x DS3, and M13/G.747 – Ethernet and existing legacy services multiplexed into a channelized DS3, with 1+1 protection.

The EtherMap®-PDH device is compliant with the recently ratified ITU-T G.8040 and G.7043 standards. Feature-rich functions such as VLAN separation, Q-in-Q, granular VCGs and over-subscription allow a complete System-on-a-Chip (SoC) solution. The EtherMap®-PDH device can be designed into any platform with PDH interfaces.

Application Diagram

TranSwitch IP Communications, Multicore Processor


  • Hardware: Support for GFP-F (ITU-T G.8040 & G.7043), HDLC (RFC 1662) and LAPS (ITU-T x.86)
  • Hardware: PDH virtual concatenation (ITU-T G.7043)
  • Hardware: Dynamic bandwidth allocation using LCAS (ITU-T G.7042)
  • Hardware: M13/G.747 multiplexing of E1/T1/J1 into channelized DS3 (with 1+1 protection)
  • Hardware: 16 Virtual Container Groups (VCGs)
  • Hardware: VLAN separation for statistical multiplexing
  • Hardware: Q-in-Q (IEEE 802.1 ad)
  • Software: API-based device driver
  • Data Path: 4 x SMII (support for RMII/MII)
  • Data Path: 16 x E1/T1/J1
  • Data Path: 3 x DS3
  • Microprocessor: Intel/Motorola compatible
  • Other: JTAG Boundary Scan (IEEE 1149.1)



TranSwitch IP Communications, Multicore Processor

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